How to design multi layer PCB board for SMT PNP

Today author from qihe smt pick and place machine tell you about rapid proofing of multi-layer pcb boards for smt pick and place machine has the following difficulties:

Interlayer alignment Due to the large number of layers in a multi-layer PCB board.

Most users have higher and higher calibration requirements for PCB layers.

Typically, the alignment tolerance between layers is controlled at 75 microns. Considering the large unit size of the multi-layer PCB board.

The high temperature and humidity in the graphics conversion workshop. The dislocation overlap caused by the inconsistency of different core boards.And the interlayer positioning method.

The alignment control of the multi-layer PCB board is more and more difficult.

Internal circuit production The multi-layer pcb board adopts high TG, high speed, high frequency, thick copper, thin dielectric layer and other materials.

Which puts forward high requirements for internal circuit production and graphic size control. For example, the integrity of impedance signal transmission adds to the difficulty of internal circuit fabrication.

In the rapid proofing process of the pcb board, the width and line spacing are small,

open and short circuits are added, short circuits are added,

And the pass rate is low; there are many signal layers of thin lines, and the detection probability of AOI leakage in the inner layer is increased;

the inner core board is thin, easy to wrinkle, and poor exposure. ,

It is easy to bend when the etching machine is used; the high-level plate is mostly a system board, the unit size is large, and the product scrapping cost is high.

Compression manufacturing In the process of rapid proofing of pcb boards,

many inner core boards and prepreg boards are superimposed,

and defects such as sliding plates, delamination, resin voids and bubble residues simply appear in stamping production.

In the design of the laminate structure, the heat resistance, pressure resistance,

glue content and dielectric thickness of the material should be fully considered,

and a reasonable multi-layer circuit board material pressing plan should be formulated.

Due to the large number of layers of the pcb board, the expansion and contraction control and size coefficient compensation cannot be kept consistent,

And the thin interlayer insulating layer is simple, which leads to the failure of the interlayer reliability test.

Drilling In the process of rapid proofing of pcb boards, some boards have added difficulty in drilling roughness, drilling burrs and decontamination.

The number of layers is large, the total copper thickness and plate thickness are accumulated,

And the drilling tool is easy to break; the CAF failure problem cause

Read more: How to design multi layer PCB board for SMT PNP

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